Samsung Electronics, the world's top memory chip producer, is betting big on three-dimensional (3D) NAND flash memory chips.
These chips are used in the next-generation solid state drives (SSDs) for corporate servers and data centers.
An advantage of 3D NAND chips is they require a more relaxed geometry process than planar NAND. In one-dimensional NAND, cells run out of electrons as they scale down the micron trail.
With only tens of electrons per cell at the sub-20-nanometer-level processing technology, a NAND chip's performance is quite unpredictable.
A 3D NAND chip, in contrast, has hundreds of electrons per cell, which greatly improves memory production efficiency, density, data storage capacity and performance over existing chips.
The global memory chip market is controlled by the "big three" companies ― Samsung, SK hynix and Micron Technology.
The two Korean chip makers ― Samsung and SK hynix ― are speeding up development of 3D NAND production technology.
Industry officials said Samsung's 3D NAND flash facilities in Xian, China, were on track to improve the quality of the chips before shipping them to clients such as Google, Hewlett-Packard and IBM.
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Friday, January 30, 2015
SAMSUNG AND SK HYNIX PUSHES FOR 3-D NAND MEMORY SSD, AS SOLID STATE MEMORY TAKES OVER THE SERVER CLASS HARD DRIVES AND 3-D NAND BRINGS IN THE DENSITY REQUIRED AT A COMFORTABLE LOWER COST FOR GOOGLE, HP, AND IBM SERVER CLIENTS - THE GLOBAL MEMORY CHIPS ARE CONTROLLED BY SAMSUNG, SK HYNIX AND MICRON
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